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A Novel Cu/CNT Material System for Through Silicon Via Interconnects
The objectives of this project is to develop and examine a new material system for interconnects used inmicro/nanoelectronics. The material system proposed in this study is expected to overcome several issues of current copper interconnects. It will make it possible to fabricate nanoscale interconnects with a low resistance and high strength and provide a durable solution for next generation of nano-interconnects. Utilizing advanced micro/nanofabrication processes, carbon nanotubes (CNTs) will be grown inside through silicon vias and copper matrix will be added to enhance the density, strength and conductivity of the CNTs. Electrical and mechanical tests and simulations will be used to evaluate the reliability and electrical functionality of the interconnects.
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The objectives of this project is to develop and examine a new material system for interconnects used inmicro/nanoelectronics. The material system proposed in this study is expected to overcome several issues of current copper interconnects. It will make it possible to fabricate nanoscale interconnects with a low resistance and high strength and provide a durable solution for next generation of nano-interconnects. Utilizing advanced micro/nanofabrication processes, carbon nanotubes (CNTs) will be grown inside through silicon vias and copper matrix will be added to enhance the density, strength and conductivity of the CNTs. Electrical and mechanical tests and simulations will be used to evaluate the reliability and electrical functionality of the interconnects. News _ Smith Group (PDF)
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Keshawarz, A., Sadowski, M., Ladani, L., 2018. Direct Metal Laser Melting of Inconel 718: Process Impact on Grain Formation and Orientation Journal of Alloys and Compounds, Volume 736, 5 March 2018, Pages 297-305 Link
Stromer, J., Ladani, L., 2018. Examination of a spectral-based ultrasonic analysis method for materials characterization and evaluation Biomedical Signal Processing and Control, Volume 40, February 2018, Pages 454-461 Link
Ladani, L., Andreotta, R., & Brindley, W. (2017). Finite element simulation of laser additive melting and solidification of Inconel 718 with experimentally tested thermal properties. Finite Elements in Analysis and Design, 135, 36–43. Link
Ladani, L., Awad, I., She, Y., Dardona, S. and Schmidt, W., 2017. Fabrication of Carbon Nanotube/Copper and Carbon Nanofiber/Copper Composites for Microelectronics. Materials Today Communications, Volume 11, June 2017, Pages 123–131 Link
Ladani, L., Romano, J., Brindley, W. and Burlatsky, S., 2016. Effective Liquid Conductivity for Improved Simulation of Thermal Transport in Laser Beam Melting Powder Bed Technology. Additive Manufacturing. Link
Choudhury, S.F. and Ladani, L., 2016. Miniaturization of micro-solder bumps and effect of IMC on stress distribution. Journal of Electronic Materials, 45(7), pp.3683-3694. Link
Choudhury, S.F. and Ladani, L., 2016. Local shear stress-strain response of Sn-3.5 Ag/Cu solder joint with high fraction of intermetallic compounds: Experimental analysis. Journal of Alloys and Compounds, 680,pp.665-676. Link
Sadowski, M., Ladani, L., Brindley, W. and Romano, J., 2016. Optimizing quality of additively manufactured Inconel 718 using powder bed laser melting process. Additive Manufacturing, 11, pp.60-70. Link
Ladani, L., 2016. Erratum to: Local and Global Mechanical Behavior and Microstructure of Ti6Al4V Parts Built Using Electron Beam Melting Technology. Metallurgical and Materials Transactions A, 5(47), pp.2537-2537. Link
Romano, J., Ladani, L., Razmi, J. and Sadowski, M., 2015. Temperature distribution and melt geometry in laser and electron-beam melting processes–A comparison among common materials. Additive Manufacturing, 8, pp.1-11. Link
Choudhury, S.F. and Ladani, L., 2015. Effect of intermetallic compounds on the thermomechanical fatigue life of three-dimensional integrated circuit package microsolder bumps: finite element analysis and study. Journal of Electronic Packaging, 137(4), p.041003. Link
Ladani, L. and Abdelhadi, O., 2015. Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation. Journal of Electronic Packaging, 137(1), p.014501. Link
Magee, A.C. and Ladani, L., 2015. Representation of a microstructure with bimodal grain size distribution through crystal plasticity and cohesive interface modeling. Mechanics of Materials, 82, pp.1-12. Link
Ladani, L., 2015. Local and Global Mechanical Behavior and Microstructure of Ti6Al4V Parts Built Using Electron Beam Melting Technology. Metallurgical and Materials Transactions A, 46(9), pp.3835-3841. Link
Awad, I. and Ladani, L., 2015. Mechanical integrity of a carbon nanotube/copper-based through-silicon via for 3D integrated circuits: a multi-scale modeling approach. Nanotechnology, 26(48), p.485705. Link
Choudhury, S.F. and Ladani, L., 2015. Single crystal plasticity finite element analysis of Cu6Sn5 intermetallic. Metallurgical and Materials Transactions A, 46(3), pp.1108-1118. Link
Ladani, L., 2015. Copper-CNT Hybrid TSVs: Thermo-Mechanical Stresses and Reliability Analysis. International Journal of High Speed Electronics and Systems, 24(03n04), p.1550006. Link
Romano, J., Ladani, L.and Sadowski, M., 2015. Thermal modeling of laser based additive manufacturing processes within common materials. Procedia Manufacturing, 1(03n04), pp.238-250. Link
Ladani, L., Razmi, J. and Choudhury, S.F., 2014. Mechanical Anisotropy and Strain Rate Dependency Behavior of Ti6Al4V Produced Using E-Beam Additive Fabrication. Journal of Engineering Materials and Technology, 136(3), p.031006. Link
Choudhury, S.F. and Ladani, L., 2014. Grain growth orientation and anisotropy in Cu6Sn5 intermetallic: nanoindentation and electron backscatter diffraction analysis. Journal of electronic materials, 43(4), pp.996-1004. Link
Awad, I. and Ladani, L., 2014. Cohesive zone model for the interface of multiwalled carbon nanotubes and copper: molecular dynamics simulation. Journal of Nanotechnology in Engineering and Medicine, 5(3), p.031007. Link
Razmi, J., Ladani, L., and Aggour, S.M., 2014. Finite element simulation of pile behaviour under thermo-mechanical loading in integral abutment bridges. Structure and Infrastructure Engineering, 10(5), pp.643-653. Link
Abdelhadi, O.M. and Ladani, L., 2013. Effect of joint size on microstructure and growth kinetics of intermetallic compounds in solid-liquid interdiffusion Sn3. 5Ag/Cu-substrate solder joints. Journal of Electronic Packaging, 135(2), p.021004. Link
Magee, A.C. and Ladani, L., 2013. Temperature dependency of mechanical behavior and strain rate sensitivity of an Al–Mg alloy with bimodal grain size. Materials Science and Engineering: A, 582, pp.276-283. Link
Razmi, J., Ladani, L., and Aggour, M.S., 2013. Fatigue crack initiation and propagation in piles of integral abutment bridges. Computer‐Aided Civil and Infrastructure Engineering, 28(5), pp.389-402. Link
Awad, I. and Ladani, L., 2013. Interfacial strength between single wall carbon nanotubes and copper material: molecular dynamics simulation. Journal of Nanotechnology in Engineering and Medicine, 4(4), p.041001. Link
Abdelhadi, O.M., Magee, A.C., and Ladani, L., 2013. Optimization of Preparation Process for Successful Electron Backscatter Diffraction of Multilayer Specimens: Application to Lead-Free Solder Joints. Journal of Advanced Microscopy Research, 8(1), pp.10-20. Link
Abdelhadi, O. and Ladani, L., 2013. Effect of joint size on microstructure and growth kinetics of intermetallic compounds in solid-liquid interdiffusion Sn3.5Ag/Cu-substrate solder joints. ASME Journal of Electronic Packaging, 135(2), p.021004. Link
Magee, A.C. and Ladani, L.J., 2013. Temperature Effects in Al 5083 with a Bimodal Grain Size. In MRS Proceedings (Vol. 1513, pp. mrsf12-1513). Cambridge University Press. Link
Magee, A. and Ladani, L., 2013. Strength and Failure of Ultrafine Grain and Bimodal Al‐Mg Alloy at High Temperatures. Light Metals 2013, pp.277-282. Link
Abdelhadi, O.M. and Ladani, L., 2012. IMC growth of Sn-3.5 Ag/Cu system: combined chemical reaction and diffusion mechanisms. Journal of Alloys and Compounds, 537, pp.87-99. Link
Magee, A., Ladani, L., Topping, T.D. and Lavernia, E.J., 2012. Effects of tensile test parameters on the mechanical properties of a bimodal Al–Mg alloy. Acta Materialia, 60(16), pp.5838-5849. Link
Harvey, E., Ladani, L. and Weaver, M., 2012. Complete mechanical characterization of nanocrystalline Al–Mg alloy using nanoindentation. Mechanics of Materials, 52, pp.1-11. Link
Ladani, L. and Razmi, J., 2012. Mechanical strength and failure characterization of sn-ag-cu intermetallic compound joints at the microscale. Journal of electronic materials, 41(3), pp.573-579. Link
Razmi, J., Ladani, L. and Aggour, M.S., 2012. Fatigue life of piles in integral-abutment bridges: Case study. Journal of Bridge Engineering, 18(10), pp.1105-1117. Link
Nelson, S., Ladani, L., Topping, T. and Lavernia, E., 2011. Fatigue and monotonic loading crack nucleation and propagation in bimodal grain size aluminum alloy. Acta Materialia, 59(9), pp.3550-3570. Link
Abdelhadi, O.M., Ladani, L. and Razmi, J., 2011. Fracture toughness of bonds using interfacial stresses in four-point bending test. Mechanics of Materials, 43(12), pp.885-900. Link
Gyllenskog, J. and Ladani, L., 2011. Fatigue crack initiation and propagation in aileron lever using successive-initiation modeling approach. Journal of Aircraft, 48(4), pp.1387-1395. Link
Ladani, L. and Nelson, S., 2011. Transition of crack propagation path under varied levels of load in bimodal grain size Al-Mg alloy. Journal of Engineering Materials and Technology, 133(4), p.041017. Link
Ladani, L.J., 2010. Numerical analysis of thermo-mechanical reliability of through silicon vias (TSVs) and solder interconnects in 3-dimensional integrated circuits. Microelectronic Engineering, 87(2), pp.208-215. Link
Ladani, L.J., 2010. Stress analysis of 3-dimensional IC package as function of structural design parameters. Microelectronic Engineering, 87(10), pp.1852-1860. Link
Ladani, L.J., 2010. Successive softening and cyclic damage in viscoplastic material. Journal of Electronic Packaging, 132(4), p.041011. Link
Ladani, L.J., Razmi, J. and Bentley, J., 2010. Microstructure and mechanical strength of snag-based solid liquid inter-diffusion bonds for 3 dimensional integrated circuits. Thin Solid Films, 518(17), pp.4948-4954. Link
Ladani, L.J. and Razmi, J., 2010. Probabilistic design approach for cyclic fatigue life prediction of microelectronic interconnects. IEEE Transactions on Advanced Packaging, 33(2), pp.559-568. Link
Ladani, L.J. and Nelson, S., 2010. A novel piezo-actuator-sensor micromachine for mechanical characterization of micro-specimens. Micromachines, 1(3), pp.129-152. Link
Ladani, L.J., 2010. Failure site transition in Pb-free solder joints caused by manufacturing variabilities in BGA and MLF components in low cycle fatigue analysis. International Journal of Materials and Product Technology, 37(3-4), pp.312-327. Link
Ladani, L.J. and Dasgupta, A., 2009. A meso-scale damage evolution model for cyclic fatigue of viscoplastic materials. International Journal of Fatigue, 31(4), pp.703-711. Link
Ladani, L.J. and Razmi, J., 2009. An anisotropic mechanical fatigue damage evolution model for Pb-free solder materials. Mechanics of Materials, 41(7), pp.878-885. Link
Ladani, L.J. and Dasgupta, A., 2008. Damage initiation and propagation in voided joints: modeling and experiment. Journal of electronic packaging, 130(1), p.011008. Link
Ladani, L.J., Dasgupta, A., Cardoso, I. and Monlevade, E., 2008. Effect of selected process parameters on durability and defects in surface-mount assemblies for portable electronics. IEEE Transactions on Electronics Packaging Manufacturing, 31(1), pp.51-60. Link
Ladani, L.J., 2008. Reliability estimation for large-area solder joints using explicit modeling of damage. IEEE Transactions on Device and Materials Reliability, 8(2), pp.375-386. Link
Ladani, L.J., 2008. Estimating fatigue damage model constants with maximum likelihood method. International Journal of Materials and Structural Integrity, 2(1-2), pp.164-172. Link
Ladani, L.J. and Dasgupta, A., 2007. Effect of voids on thermomechanical durability of Pb-free BGA solder joints: Modeling and simulation. Journal of electronic packaging, 129(3), pp.273-277. Link
Ladani, L.J., Das, D., Cartwright, J.L., Yenkner, R. and Razmi, J., 2006. Implementation of Six Sigma quality system in Celestica with practical examples. International Journal of Six Sigma and Competitive Advantage, 2(1), pp.69-88. Link