Materials Characterization & Analysis

Services, Equipment & Capabilities

The Manufacturing Innovation Recharge Center provides materials characterization services for researchers, industry partners and government organizations. Our materials characterization services help evaluate the thermal, structural, electrical and physical properties of engineering materials used in manufacturing, product development and research. These services support metals, polymers, ceramics, composites, electronic materials and additively manufactured components using advanced analytical instrumentation and nondestructive testing methods.

TA DLF-2 WITH EM-1600<br />
Thermal property measurement system used to determine thermal diffusivity and thermal conductivity of solid materials.<br />

Thermal diffusivity and thermal conductivity

Measure thermophysical properties. This service provides room-temperature and high-temperature thermal diffusivity measurements, thermal conductivity calculations and specific heat capacity measurements for advanced engineering materials.

Applications

  • Thermal diffusivity measurement
  • Thermal conductivity evaluation
  • Specific heat capacity measurement
  • High-temperature thermal characterization

Equipment used

TA Instruments DLF-2 with EM-1600 furnace

Simultaneous thermal analysis system combining thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC).<br />

Thermal analysis (DSC & TGA)

Evaluate thermal stability, heat flow and mass change during controlled heating and cooling cycles. This service provides an understanding of phase transitions, oxidation behavior, decomposition and thermal capacity.

Applications

  • Differential Scanning Calorimetry (DSC)
  • Thermogravimetric Analysis (TGA)
  • Thermal capacity measurement
  • Thermal stability analysis

Equipment used

TA Instruments SDT 650

High-resolution X-ray computed tomography system for non-destructive 3D imaging and analysis of internal material structures.<br />

3D X-ray microscopy and microstructural analysis

Perform non-destructive three-dimensional imaging using high-resolution X-ray microscopy. This service reveals internal structures, porosity, cracks, inclusions and microstructural features without sectioning the sample.

Applications

  • 3D X-ray imaging
  • X-ray computed tomography (CT)
  • Microstructural analysis
  • Internal defect detection

Equipment used

ZEISS Xradia 520 Versa X-ray CT

 

Non-destructive instrument for measuring electrical conductivity of metallic materials.<br />

Electrical conductivity testing

Measure the electrical conductivity of metallic materials and conductive components to evaluate material quality, alloy composition and manufacturing consistency. This service supports quality assurance, material verification and process validation.

Applications

  • Electrical conductivity testing
  • Conductivity verification
  • Material comparison

Equipment used

Fischer SigmaScope SMP350

Surface metrology instrument used to assess and quantify surface texture and finish.<br />

Surface roughness measurement

Quantify surface finish and surface texture to evaluate machining quality, additive manufacturing performance and post-processing effectiveness. This service help verify dimensional quality and support component performance requirements.

Applications

  • Surface roughness measurement
  • Surface finish evaluation
  • Manufacturing quality inspection

Equipment used

VTSYIQUI Surface Roughness Tester

High-resolution infrared thermal camera for non-contact temperature measurement and thermal visualization.<br />

Thermal imaging and thermal deformation analysis

Monitor temperature distribution and thermal deformation using high-resolution infrared imaging during testing. This service supports in situ measurements of warpage, deflection and coefficient of thermal expansion (CTE), providing valuable information for thermal management and product development.

Applications

  • Infrared thermal imaging
  • In situ warpage measurement
  • Coefficient of thermal expansion (CTE)

Equipment used

Optris PI 640i Thermal Camera

    Non-contact digital image correlation system for full-field 2D and 3D displacement and strain measurements.<br />

    Digital Image Correlation (DIC)

    Measure full-field strain, displacement and deformation using non-contact Digital Image Correlation (DIC). This service provides highly accurate deformation measurements during tensile testing under ambient, elevated-temperature and liquid-environment conditions.

    Applications

    • Tensile testing
    • High-temperature tensile testing
    • Tensile testing in liquid environments
    • Micro-tensile testing

    Equipment used

    Dantec Dynamics FlexDIC (3-camera system)

    Access, Rates & Scheduling

    Services are available on a fee-for-service basis. For service details, rates, or scheduling, please contact Dr. Leila Ladani ([email protected]), Director of the Manufacturing Innovation Recharge Center.